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KiCAD Design Rules

Based on JLPCB capabilities with extra margin.

  • Clearance: 0.5mm
  • Minimum width: 0.25mm
  • Thermal relief gap: 0.5mm
  • Thermal spoke width: 0.5mm

Solder Mask/Paste

  • Solder mask minimum web width: 0.25mm

Text & Graphics

  • Silk Layers
    • Line Thickness
    • Text Width: 0.8mm
    • Text Height: 0.8mm
    • Text Thickness: 0.1mm

Design Rules

  • Allow blind/buried vias: No
  • Allow micro vias: No

  • Copper
    • Minimum clearance: 0.2mm
    • Minimum track width: 0.15mm
    • Minimum annular width: 0.2mm
    • Minimum via diameter: 0.4mm
    • Copper to hole clearance: 0.35mm
    • Copper to edge clearance: 0.2mm
  • Holes
    • Minimum through hole: 0.2mm
    • Hole to hole clearance: 0.35mm
  • uVias
    • Minimum uVia diameter: 0.2mm
    • Minimum uVia hole: 0.1mm
  • Silkscreen
    • Minimum item clearance: 0mm